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【选型指南】148.5mhz晶振封装及料号大全

作者: 扬兴科技 日期:2021-06-30 浏览量:

  在电子设备中,晶振可以产生高度稳定的信号,使得我们电路板得以正常运作。但是晶振的频点、封装、电压、频差等参数太多、选型难?怎么办呢?

  扬兴科技3分钟帮您快速选好选对!下面是介绍148.5mhz晶振型号及封装尺寸,帮您锁定晶振型号需求,工温、民温均可满足定制。

  01、有源晶振型号

石英差分晶振,贴片晶振,石英晶振,扬兴晶振

  石英差分晶振:YSO230LR

  封装尺寸:3.2x2.5mm (3225),7.0x5.0mm (7050)

  专属料号:OB32251485MLDC6SI,OB70501485MLDB6SI,OB70501485MLDC6SI

  02、石英可编程晶振型号

  石英可编程晶振:YSO690PR

YSO690PR,石英可编程晶振,有源晶振

  封装尺寸:3.2x2.5mm (3225),5.0x3.2mm (5032),7.0x5.0mm (7050)

  专属料号:O93225148.5MEDA4SI,O95032148.5MEDA4SI,O97050148.5MEDA4SI

  差分可编程晶振:YSO210PR

差分晶振,有源振荡器

  封装尺寸:3.2x2.5mm (3225),5.0x3.2mm (5032),7.0x5.0mm (7050)

  专属料号:OA3225148.5MEDB6SI,OA5032148.5MEDB6SI,OA5032148.5MBDB6SI,OA5032148.5MEDC6SI,OA5032148.5MBDC6SI,OA7050148.5MBDB6SI,OA7050148.5MEDB6SI

  爱普生可编程晶振:SG-8018CG/CE/CA

爱普生晶振,差分晶振,晶振代理商

  封装尺寸:3.2x2.5mm (3225)

  专属料号:SG-8018CE 148.500000MHz TJHPA

  03、MEMS硅可编程晶振型号

  低抖动晶振:YSO8209MR

硅晶振,有源晶体振荡器,贴片晶振

  封装尺寸:3.2x2.5mm (3225),7.0x5.0mm (7050)

  专属料号:O32251485MEDB4MI,O70501485MEDH4MI

  低频差分晶振:YSO9121MR

差分晶振,扬兴晶振,扬兴科技

  封装尺寸:3.2x2.5mm (3225),5.0x3.2mm (5032),7.0x5.0mm (7050)

  专属料号:O32251485MKDB6MI,O32251485MEDB6MI,O32251485MBDB6MI,O50321485MEDB6MI,O50321485MBDB6MI,O50321485MKDB6MI,O50321485MEDC6MI,O70501485MEDB6MI,O70501485MBDB6MI

  Sitime低频差分晶振:SIT9121

低频差分晶振,差分振荡器,sitime晶振

  封装尺寸:3.2x2.5mm (3225)

  专属料号:SIT9121AI-2B13E148.500000D,SIT9121AI-2B23E148.500000D,SIT9121AC-2B3-25E148.500000D

  Sitime差分晶振:SIT9120

sitime晶振,sitime晶振代理商,进口晶振

  封装尺寸:3.2x2.5mm (3225),7.0x5.0mm (7050)

  专属料号:SIT9120AC-2B33S148.500000DI,SIT9120AI-2D23E148.500000Y

  以上是小扬整理的常用148.5mhz晶振产品系列和相关料号,详细产品规格书可直接在YXC官网私聊客服小姐姐获取!也可以让客服小姐姐按业务与您对接,快速帮您的方案匹配选型。

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